JPH0741161Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH0741161Y2 JPH0741161Y2 JP1988096005U JP9600588U JPH0741161Y2 JP H0741161 Y2 JPH0741161 Y2 JP H0741161Y2 JP 1988096005 U JP1988096005 U JP 1988096005U JP 9600588 U JP9600588 U JP 9600588U JP H0741161 Y2 JPH0741161 Y2 JP H0741161Y2
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- ground
- metal substrate
- pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000004020 conductor Substances 0.000 claims description 32
- 229910052751 metal Inorganic materials 0.000 claims description 20
- 239000002184 metal Substances 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Waveguides (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096005U JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096005U JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217847U JPH0217847U (en]) | 1990-02-06 |
| JPH0741161Y2 true JPH0741161Y2 (ja) | 1995-09-20 |
Family
ID=31320794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096005U Expired - Lifetime JPH0741161Y2 (ja) | 1988-07-20 | 1988-07-20 | 混成集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741161Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2646988B2 (ja) * | 1993-12-24 | 1997-08-27 | 日本電気株式会社 | 樹脂封止型半導体装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6372180A (ja) * | 1986-09-12 | 1988-04-01 | ティーディーケイ株式会社 | 電子部品及びその製造方法 |
| JPS6359370U (en]) * | 1986-10-06 | 1988-04-20 |
-
1988
- 1988-07-20 JP JP1988096005U patent/JPH0741161Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217847U (en]) | 1990-02-06 |
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